ITEM |
DESCRIPTION |
PRICE |
1 |
Minimum Service Charge (Up to 3 units. See below for work )
- Visual inspection of package (No microscope)
- Lead cleaning (BGA reballing is extra – See below #6)
- Test to production test program at 3 temperatures
(25C, min spec temperature, max spec temperature)
- Preliminary report generation
- Add $100 each for additional unit done at the same time.
- Add $100/unit for Reballing service for BGA.
|
$500.00 |
2 |
Bit map analysis service if memory product (Up to 3 units)
- Test on engineering bit map analysis tester
at 3 temperatures
(25C, min spec temperature, max spec temperature)
- Add $100 each for additional unit done at the same time.
|
|
3 |
Scanning Acoustic Microscopy Analysis service (Up to 3 units)
Add $75 each for additional unit done at the same time.
|
|
4 |
Decapsulation of plastic package service (Up to 3 units)
Add $100 each for additional unit done at the same time.
|
|
5 |
Emission Microscopy Analysis service (Up to 3 units)
Add $50 each for additional unit done at the same time. |
$200.00 |
6 |
High power microscope optical inspection of die (Up to 3 units)
Add $40 each for additional unit done at the same time. |
$150.00 |
7 |
Focus Ion Beam Service (Up to 3 units, one cut or deposit/device)
Add $100 each for each additional unit or additional cut done
at the same time.
|
$300.00 |
8 |
Deprocessing service of silicon die (layer by layer) per each unit
Price may be higher depending on work required.
Please contact Alliance Failure Analysis Service Department
for final quote based on your requirement. |
$2,500.00 minimum |
9 |
Additional report generation service on the above analysis #2-#8.
Price may be higher depending on work required.
|
$200.00 minimum |
10 |
Any other analysis requirement
Please contact Alliance Failure Analysis Service Department
for a quote based on your requirement.
|
Request quote |
