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SANTA CLARA, Calif., (March 15, 2004) - Alliance Semiconductor Corporation
(NASDAQ: ALSC), a leading worldwide provider of analog and mixed signal
products, high-performance memory products and systems solutions for
the communications, computing, embedded, industrial and consumer markets,
today announced the availability of its 36-megabit (36Mb) Synchronous
SRAM family. Manufactured using state-of-the-art 0.13-micron copper
process technology, Alliance's 36Mb Syncronous SRAMs provide higher
densities, lower access latency, and lower power consumption to increase
system performance in a variety of applications and end markets including
storage systems, wireless infrastructure and networking.
The 36Mb family expands Alliance's growing Syncronous SRAM product portfolio
ranging from 2Mb to 36Mb devices and strengthens Alliance's support
and commitment to providing its customers with an extensive selection
of high-density, high speed and leading-edge memory products for multiple
vertical market applications.
"The addition of this 36Mb product family to our portfolio enables
Alliance to provide higher density, higher bandwidth memory offerings
while maintaining the low latency packet buffering requirements necessary
for data storage, networking and embedded applications," said Bhanu
Nanduri, Vice President and General Manager of System Solutions for
Alliance.
Alliance's 36Mb Synchronous SRAM device configurations include 1Mbx32,
1Mbx36, and 2Mbx18 operating at either 3.3-V or 2.5-V. The devices are
user configurable to operate in either pipelined mode or in flow-through
mode. In pipelined mode, the devices operate with clock rates up to
250MHz and with clock access time less than 2.6 ns. In flow-through
mode the clock access times is less than 6.0 ns. Both pipelined mode
and flow-through mode offer active current of 450 mA and standby currents
of 100 mA. Alliance's 36Mb Synchronous SRAM devices support fast clock
speeds with no turnaround delay (NTD) or synchronous burst interfaces.
In addition, Alliance offers both the 100-lead TQFP and the space saving
165-ball BGA industry standard packaging options.
Samples are available now with production quantities available in the
second quarter of 2004. These devices are available in 166 MHz, 200
MHz and 250 MHz with either a synchronous burst or the NTD interface.
Pricing starts at $55.00 for 250MHz devices in quantities of 10,000
units.
About Alliance
Alliance Semiconductor Corporation (NASDAQ: ALSC) is powering every
application with high performance solutions for the communications,
computing and consumer electronics markets. Utilizing advanced process
technologies and design expertise, Alliance provides leading OEMs with
a broad portfolio of complementary technologies including analog and
mixed-signal products, chip-to-chip connectivity products, networking
controllers and high-performance memories. Alliance addresses the complete
needs of system developers by leveraging its proprietary advances in
Electromagnetic Interference (EMI) reduction, power management and timing
technology, HyperTransport I/O connectivity and specialized memory
solutions for next-generation applications. Founded in 1985, Alliance
is headquartered in Santa Clara, California with design centers in Santa
Clara, Bangalore and Hyderabad, India. The company is publicly traded
and included in the S&P 600 Index. Additional information is available
on the Alliance Web site at: http://www.alsc.com
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