Notes
Outline
Slide 1
Alliance ROHS/Pb-free Program
Hybrid and Green Package Options
Package Option Example Summary
Package Marking for Pb-free
Mixed Signal Devices
Package Marking for Pb-free
Systems Solutions Devices
Package Marking for Pb-free BGA Devices
Package Marking for Pb-free
Memory Devices
Alliance ROHS/Pb-free Program
Marking and Labeling, Qualification
Marking and Labeling:
Alliance has a Pb-free labeling method for the packaging of all Pb-free products. The lowest level shipping container shall identify the products as Pb-free.
Qualification:
Alliance Pb-free packages comply with the most current JEDEC JSTD-020 standard for peak reflow temperature (260°C for small packages, 250 C for medium size packages, and 245°C for large size packages. Size is defined in JEDEC J-STD-020).
Reliability tests include Temperature Cycle, Autoclave  and Temperature/Humidity under the standard test conditions. Additionally, Alliance works with suppliers and partners to perform tin whisker, and solderability tests. Data for these tests are available upon request. Reliability tests for some  packages are under progress
Alliance ROHS/Pb-free Program
 Material Sets, Readiness to Supply Pb-free Parts
Material Sets:
By collaborating with our suppliers, Alliance sources the best material sets for lead free applications. The material sets must be reliable, environmentally friendly, and robust to meet the requirement of higher reflow temperature (up to 260°C max.). The mold compound that Alliance uses for lead free packaging are free of Brominated Flame retardants. Additionally, Alliance  Pb-free packages comply with the RoHS Directive and do not contain any of the following materials: Lead, Mercury, Cadmium, Hexavalent Chromium, and the PBDE and PBB flame retardants. For the solder finish/material, the lead free packages have pure matte tin plating finish or Sn-Bi plating. These materials are industry preferred materials and are chosen due to their availability, lower cost, and reliability.
Readiness to supply lead free parts:
Alliance has already qualified most packages for the lead free process and will complete qualification of all existing packages for lead free process by Q1 2005.
Lead free samples are available upon request for all existing products.
Reportable Chemical Substances in ALSC products
Reportable Chemical Substances in ALSC products
Connectivity and Networking
Reportable Chemical Substances in ALSC products
Connectivity and Networking
Reportable Chemical Substances in ALSC products
Asynchronous SRAM
Reportable Chemical Substances in ALSC products
Asynchronous SRAM
Reportable Chemical Substances in ALSC products
Asynchronous SRAM
Reportable Chemical Substances in ALSC products
Asynchronous SRAM
Reportable Chemical Substances in ALSC products
Synchronous SRAM
Reportable Chemical Substances in ALSC products
Synchronous SRAM
Reportable Chemical Substances in ALSC products
Synchronous SRAM
Reportable Chemical Substances in ALSC products
 Synchronous SRAM
Reportable Chemical Substances in ALSC products
 Synchronous SRAM
Reportable Chemical Substances in ALSC products
Synchronous SRAM
Reportable Chemical Substances in ALSC products
Synchronous SRAM
Reportable Chemical Substances in ALSC products
Clock and Timing devices
     Click on the packages given below to get the reportable chemical substances in ALSC Clock and Timing Devices
8L SOIC
16L SOIC
8L TSSOP
16L TSSOP
6L TSOT
Reportable Chemical Substances in ALSC products
Supervisory devices
       Click on the packages given below to get the reportable chemical substances in ALSC Supervisory Devices
8L SOIC
8L PDIP
8L MSOP
3L SOT23
3L SOT89
3L TO-92
4L SOT143
4L SOT223
Recommended Soldering Profile
Recommended Reflow Profile for
TSOP1 and TSOP2 Packages
Recommended Reflow Profile for SOJ packages
Recommended Reflow profile for
100L LQFP packages